Product Description

WEIPENG® is a leading HK-04G Two-Pin Weipeng Micro Switch manufacturers, suppliers and exporter.

Micro Switch Introduction

As Leqing Tongda's classic switch designed for general use scenarios, the HK-04G focuses on 'high stability, wide compatibility, and cost-effectiveness,' integrating 35 years of manufacturing experience. It is suitable for smart homes, small industrial equipment, commercial appliances, and other scenarios, serving as a key circuit control component that balances reliability and cost.

Micro Switch Application

Equipped with an optimized micro quick-acting trigger mechanism, the actuation travel is precisely controlled between 0.15-0.3mm, with an operating force range of 1.2-3N. The pressing feel is light and the feedback is crisp, without any hysteresis or sticking, allowing for precise control with a 'light touch activation.' The contacts are made of high-purity silver alloy and undergo a precision plating process, with an initial contact resistance of ≤30mΩ. The rated load supports 0.1A/250V AC and 0.5A/125V AC, specifically designed for low-power electronic devices, effectively preventing contact failure caused by contact oxidation.

Small Industrial / Commercial: Suitable for conveyor equipment, coffee machines, and printers. Optimization of terminal structure improves assembly efficiency. Custom versions, after adjusting terminal spacing, increase installation efficiency by 25%.

Micro Switch Specification

Switch Technical Characteristics:
ITEM	Technical Parameter		Value
1	Electrical Rating		5(2)A 125V/250VAC 10(3)125V/250VAC
2	Contact Resistance		≤50mΩ Initial value
3	Insulation Resistance		≥100MΩ (500VDC)
4	Dielectric Voltage	Between non-connected terminals	500V/0.5mA/60S
		Between terminals and the metal frame	1500V/0.5mA/60S
5	Electrical Life		≥10000 cycles
6	Mechanical Life		≥100000 cycles
7	Operating Temperature		-25~125℃
8	Operating Frequency		Electrical :15 cycles Mechanical :60 cycles
9	Vibration Proof		Vibration Frequency :10~55HZ; Amplitude :1.5mm; Three directions :1H
10	Solder Ability : More than 80% of immersed part shall be covered with solder		Soldering Temperature : 235±5℃ Immersing Time :2~3S
11	Solder Heat Resistance		Dip Soldering :260±5℃ 5±1S Manual Soldering :300±5℃ 2~3S
12	Safety Approvals		UL、CSA、VDE、ENEC、CE
13	Test Conditions		Ambient Temperature :20±5℃ Relative Humidity :65±5%RH Air Pressure : 86~106KPa